Doosan Corp. bets $700 mil. on chip substrate material biz

Doosan Corp. has announced a significant investment of $702.6 million to expand its production capacity for copper clad laminates, a crucial material used in advanced semiconductor substrates. This investment is a major bet on the growing demand for semiconductor technology, which is driving innovation in various industries. The expansion of production capacity will enable Doosan Corp. to meet increasing demand for its products and potentially increase its market share in the global semiconductor industry.

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Doosan Corp. 's investment in chip substrate material business could boost Korea's tech industry.

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